Attaching soles to shoes
US4846919A · kind A · utility
2Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1988 |
| Grant date | Jul 11, 1989 |
| Priority date | — |
| Expiry date | Mar 4, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S36/01
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Method of bonding a sole to a shoe by applying moisture-curable melt adhesive to the shoe upper, subjecting the adhesive coating to a hot-cure step with airborne moisture, and pressing the sole and shoe upper together with the adhesive between them immediately after the hot-cure step, preferably in less than 90 seconds after leaving the hot-cure. The bond is effected without application of adhesive to the sole, which is merely pre-treated by wiping with solvent or primer solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.