Mounting a component to a substrate
US4846930A · kind A · utility
5Cited by
1References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 11, 1987 |
| Grant date | Jul 11, 1989 |
| Priority date | — |
| Expiry date | Jun 11, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S359/90
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of mounting an optical component such as a laser chip on a substrate. The method involves mounting the chip on a bridge and positioning the bridge on the substrate. Depending legs are provided on the bridge so that the bridge is located in the vertical direction relatively to the substrate and hence the laser chip is also located. Finally, the chip is secured to the substrate by, for example, soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.