Apparatus for the application of a conductive adhesive medium to a printed circuit board
US4848640A · kind A · utility
9Cited by
11References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 12, 1988 |
| Grant date | Jul 18, 1989 |
| Priority date | — |
| Expiry date | Feb 12, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/044
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for the application of a conductive adhesive medium in a fluid state to a side of a printed circuit board bearing electronic components is disclosed. The apparatus generally comprises a hollow shaft standing in a supply tank for the adhesive medium in an obliquely rising conveyor belt for at least one circuit board at a time. The upper end of the hollow shaft has two overflow edges arranged perpendicularly to the direction of transport for the formation of a wave, through the crest of which the side of the card previously moistened with a flux, is passed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.