Molded resin semiconductor device
US4849803A · kind A · utility
23Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 1984 |
| Grant date | Jul 18, 1989 |
| Priority date | — |
| Expiry date | Apr 20, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Diode chips 5, 6 soldered to a terminal plate 4 within a housing 1, 2 are surrounded by a low thermal expansion, high thermal conductivity thermosetting resin 13, 14, in turn covered by a flexible resin 9 having high expansion and low conductivity coefficients, in turn covered by another thermosetting resin 12. Elastic lead wires 7, 8 soldered to the diodes and embedded in the flexible resin are extended through the top resin layer by further terminal plates 10, 11. Such construction enhances heat dissipation and reduces thermal stress concentrations to thereby avoid fatigue failure in the solder connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.