Method of taking out lead of semiconductor tip part
US4850105A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1988 |
| Grant date | Jul 25, 1989 |
| Priority date | — |
| Expiry date | May 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of removing a lead from a semiconductor tip part is provided by inserting the tip part in a through hole of a substrate. The tip part is equalized in height with substrate by adhering an adhesive tape across the through hole. A gap is left between the tip part and through hole which is filled with an insulative resin. If the substrate already has electrically conductive portions on it, a conductive paste is printed on the substrate between conductive portions and the tip part. If the substrate does not already have them, the conductive portions are formed by the addition of conductive paste on the substrate and which extends to the tip part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.