Flexible circuit laminate for surface mount devices
US4851613A · kind A · utility
29Cited by
12References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 1988 |
| Grant date | Jul 25, 1989 |
| Priority date | — |
| Expiry date | Jun 8, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0989
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed invention provides a flexible circuit board for use in surface mount technology. A polyaramid fiber reinforced resin provides a substrate for a copper cladding in which a circuit is formed. Overlaying the circuitry are a plurality of spaced insulating pads also reinforced with polyaramid fiber for dimensional stability. The spaces insulated pads define fold-lines along which the circuit may be folded, thereby providing a degree of flexibility required for flexible circuit applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.