Stop for integrated circuit diaphragm
US4852408A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 1987 |
| Grant date | Aug 1, 1989 |
| Priority date | — |
| Expiry date | Sep 3, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49103
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor transducer with a diaphragm is constructed utilizing a substrate wherein a first portion of that first face is etched to a planar level to achieve a second portion as a physical stop on this substrate, the physical stop having a planar stop face, a sloping sided cavity is etched into a semiconductor wafer from a first face thereof to form a deformable diaphragm in this semiconductor wafer. The semiconductor wafer is anodically bonded to the substrate planar level, with the physical stop located in the cavity and with the stop face acting to prohibit excess movement of the diaphragm. The foregoing abstract is merely a resume of one general application, is not a complete discussion of all principles of operation or applications, and is not to be construed as a limitation on the scope of the claimed subject matter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.