Metal case for housing an IC and a manufacturing method therefor
US4852736A · kind A · utility
15Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1988 |
| Grant date | Aug 1, 1989 |
| Priority date | — |
| Expiry date | Oct 14, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A metal case for housing electronic parts including an IC and a manufacturing method therefor are disclosed. The case comprises a shallow vessel having a wall on its periphery which is formed from metal sheet having the same thickness as the bottom of said depression and a rectangular metal ring which has a contour such that it can fit into the wall of said shallow vessel, said rectangular metal ring being fit into said shallow vessel and connected thereto so as to form a single body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.