Thermal transfer material
US4853274A · kind A · utility
10Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1988 |
| Grant date | Aug 1, 1989 |
| Priority date | — |
| Expiry date | Mar 10, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31801
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal transfer material having a heat resistant layer on a base film, said heat resistant layer having an average surface roughness of 0.15 to 0.35 .mu.m and projections of 0.35 to 1.00 .mu.m high in number of 50 or more per mm.sup.2 on the surface thereof, is excellent in image quality and stability thereof without causing sticking to a thermal head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.