Patent · US Expired

Epoxy resin materials having an improved shelf life

US4853433A · kind A · utility

2Cited by

6References

7Claims

0Family size

Assignee

BASF SE

Inventors

Rainer Blum · Ludwigshafen, DE
Gerd Rehmer · Beindersheim, DE
Rolf Osterloh · Lechenich, DE
Hans Sander · Ludwigshafen, DE

Key dates

Filing date	Apr 1, 1988
Grant date	Aug 1, 1989
Priority date	—
Expiry date	Apr 1, 2008

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L63/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Epoxy resin materials essentially contain PA0 (A) an epoxy resin having a mean molecular weight of from 300 to 6,000 and on average from 1.5 to 3.0 epoxy groups in the molecule and PA0 (B) a polyacrylate resin obtainable by polymerization of essentially PA0 (b.sub.1) from 30 to 95% by weight of esters of acrylic acid and/or methacrylic acid and/or ethylacrylic acid with C.sub.1 -C.sub.20 -alcohols in the presence of PA0 (b.sub.2) from 5 to 70% by weight of carboxyl-containing copolymers having a mean molecular weight of from 500 to 20,000, obtainable by bulk or solution polymerization and are used for heat-curable finishes, adhesive bonds and coatings.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.