Semiconductor device
US4853761A · kind A · utility
4Cited by
3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 13, 1987 |
| Grant date | Aug 1, 1989 |
| Priority date | — |
| Expiry date | Mar 13, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48463
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device obtained by using plastic molding to obtain an ultraviolet ray erasable type EPROM semiconductor chip in which an ultraviolet ray transparent resin film is inserted between the semiconductor chip and the molding material so as to cover a portion of the surface or the whole surface of the semiconductor chip except for the surfaces of the wire bonding electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.