Sealing structure, method of soldering and process for preparing sealing structure
US4854495A · kind A · utility
22Cited by
7References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1987 |
| Grant date | Aug 8, 1989 |
| Priority date | — |
| Expiry date | Jun 18, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method. The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.