Structural adhesive formulations and bonding method employing same
US4855001A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1987 |
| Grant date | Aug 8, 1989 |
| Priority date | — |
| Expiry date | Feb 10, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A one-component heat stable, adhesive for metal surfaces such as iron, zinc, copper, cadmium and their alloy will cure upon contact with the metal surface. The adhesive composition includes olefinically unsaturated monomer; at least one phenoxy resin together with other reactive or non-reactive polymers; an acidic material; a compound containing sulfonyl halide group; and a compound containing a transition metal, in particular TiO.sub.2. The adhesive composition cures rapidly upon contact with a metal surface to form an adhesive bond between the surfaces. The adhesive composition is especially useful as an adhesive for galvanized steel parts subjected to elevated paint curing temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.