Sputter enhanced ion implantation process
US4855026A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 2, 1988 |
| Grant date | Aug 8, 1989 |
| Priority date | — |
| Expiry date | Jun 2, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/48
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sputter enhanced ion implantation process is disclosed that uses to advantage the ion beam sputtering phenomenon to deposit layers of coatings on surfaces of interest simultaneously with ion implanting that surface, and that without the use of a separate evaporation system. The process can be applied to almost any workpiece of varied geometries. The process can be used for the deposition of hard coatings as well as ion implanting soft solid lubricants into various substrates. The process is particularly suitable for improving the physical and chemical properties of workpieces exposed to excessive wear, erosion, corrosion and fatigue and workpieces benefitting from a reduced coefficient of friction, such as ball bearings, gears, toolings, orthopaedic surgical implants and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.