Compression molding a charge using vacuum
US4855097A · kind A · utility
15Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1986 |
| Grant date | Aug 8, 1989 |
| Priority date | — |
| Expiry date | Jul 14, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0854
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for making a part with a smooth surface, such as an exterior automotive body panel, by compression molding a charge containing a curable resin. The charge is placed on the molding surface of one of the dies of a compression mold so that the charge covers 40%-80% of the surface area of the molding surface. The molds are moved to a partially closed position and the mold cavity is quickly evacuated. The mold is then closed so that the dies compress the charge to cause it to fill the mold cavity and, after the resin cures, the part is removed from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.