Arrangement for exposing semiconductor wafers by means of a synchrotron radiation in lithographic equipment

US4856037A · kind A · utility

Assignees

• Siemens Aktiengesellschaft · DE
• Karl Suess KG GmbH & Co.
• Fraunhofer-Gesellschaft e.V. · DE

Inventors

• Karl-Heinz Mueller · Grand Rapids, US
• Hans Betz · Munich, DE
• Wilhelm Vach · Hallbergmoos, DE
• Johann Krenner · Berglern, DE

Key dates

• Filing date: Jul 15, 1987
• Grant date: Aug 8, 1989
• Expiry date: Jul 15, 2007

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70808
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An arrangement or apparatus for exposing semiconductor wafers by means of a synchrotron radiation, wherein a mask and semiconductor wafer are movable in a common, perpendicular direction relative to the direction of the X-ray beam in order to sweep an exposure field. The optical devices are provided for observing adjustment marks on the mask and semiconductor wafer to create control signals for the adjustment of the mask and wafer relative to each other. The beam radiation is conducted in a tube having a rectangular slot-shaped radiation window, which is arranged immediately adjacent to the mask and the optical devices are provided next to the beam feed tube and aligned to a part of the exposure fields lying outside of the impingement area of the beam leaving the radiation window.