Patent · US Expired

Solid state telephone protector module

US4856060A · kind A · utility

7Cited by
2References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 1, 1988
Grant dateAug 8, 1989
Priority date
Expiry dateAug 1, 2008

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/176
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A solid state protector module for individual subscriber circuits particularly suited for use with laminar type quick clip connector blocks. The module comprises a printed circuit board mounting integrated circuit protector units which are thermally sensitive. Solder preforms are resiliently urged against integrated circuit units by a shorting spring, mounting the solder preforms allowing the shorting spring to ground the individual circuit. The solder preforms including a camming circuit allowing the shorting spring to urge the preform perpendicularly to the normal direction of spring movement.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.