Fabrication of bonded structures
US4856162A · kind A · utility
8Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1988 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Aug 8, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4981
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Bonding pressure is uniformly applied to the lay-up (70) of a bonded product (10) by the disposition of flexible, compressible, perforated sheet material (85) between the lay-up and a pair of molds (75 and 80) during the manufacture of the product by diffusion bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.