Method for manufacturing terminal contacts for thin-film magnetic heads
US4856181A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1988 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Aug 26, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for manufacturing terminal contacts for thin-film magnetic heads. The method of manufacturing reinforced terminal contacts for thin-film magnetic heads provides a photolithographic process sequence that allows the technical requirements to be kept as low as possible and that reduces the gold consumption to a minimum. To that end, a copper layer for contact reinforcement fashioned as a tower is electrodeposited in contact windows formed by a photoresistive layer, which is electrodeposited onto an electrically conductive permalloy layer of a substrate before this is completely structured and has been provided with a protective aluminum oxide layer. A gold film required for the attachment of a bonding wire is finally deposited either directly preceding the protection or following the application of the aluminum oxide on the copper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.