Method for fastening electronic components to a substrate using a film
US4856185A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1987 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Dec 11, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
For fastening electronic components to substrates, a connecting layer having good adhesion and good electrical and thermal conductivity is manufactured by sintering from a metal powder layer. A paste formed of metal powder, such as a silver powder, and of a solvent, is processed into a solvent-free presintered film in a separate process. This film is punched in accordance with a cross-section of the component and is provided for fastening the component. In manufacturing the film, a specific solvent is employed, together with heating up rates of 5.degree. to 30.degree. C./Min and holding times of 0.5 to 5 minutes at a maximum temperature of 300.degree. C. The fastening is carried out at temperature of at least 150.degree. C. and at a minimum mechanical pressure of 30 N/cm.sup.2. The use of a film speeds up the method and enables of sintering at low temperatures and, at the same time, at low mechanical pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.