Method of bonding thermoplastic material using radio frequency energy
US4857129A · kind A · utility
26Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1987 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Jul 31, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2067/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Thermoplastic materials having a low dielectric loss tangent and loss index are bonded together using radio frequency energy by employing a polyvinyl chloride buffer above and below the materials being bonded while applying pressure and rf energy. The polyvinyl chloride is a highly plasticized polyvinyl chloride which has a bonding temperature lower than the bonding temperature of the material being bonded. In spite of the fact that the bonding temperature of the polyvinyl chloride is lower than the bonding temperature of the low loss material an effecitve bond is produced between the low loss material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.