Two-part adhesive for bonding plastics and metals
US4857131A · kind A · utility
14Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1987 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Nov 27, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F291/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A two-part, heat stable, peroxide-free adhesive that can be mixed in equal parts with rapid cure for the bonding of plastics and metals has been discussed. Part A of the adhesive contains a polymeric material, an olefinically unsaturated monomer, an acid material, a compound containing a sulfonyl halide group, and a compound containing a transition metal; and Part B contains a polymeric material (preferably a phenoxy resin) and monomer of the same class and a Zn, Cu or Cd metal powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.