Wet etching of cured polyimide
US4857143A · kind A · utility
17Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1988 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Dec 16, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0017
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fully cured or substantially fully cured polyimide is etched by contacting the imide with an aqueous solution of a metal hydroxide such as an alkali metal or alkali earth hydroxide and a metallic compound selected from metal carbonates, sulfates and phosphates. The presence of the carbonate, sulfate or phosphare reduces the undercutting of a resist pattern on the polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.