Method of forming bump electrode and electronic circuit device
US4857482A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1988 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Jun 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support is formed and comprises a base, a resin layer which is formed on the base and on recesses which are formed on a surface of the base, and a conductive layer which is formed on a portion of a surface of the resin layer, other than where the recesses are formed. The surface of the recesses is electrically charged by way of a corona discharge to create static electricity in the recesses. Metal balls to be formed into bump electrodes are held in the recesses by way of the static electricity. Then, each of the metal balls is bonded to a corresponding electrode terminal of an electronic component by hot press unit while the electronic component is opposed to the support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.