Stabilized polyphenylene ether-polyamide compositions
US4857575A · kind A · utility
19Cited by
9References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1987 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Oct 9, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/123
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Large molded parts made of polyphenylene ether-polyamide resin can be improved with respect to retention of physical properties after thermal aging which is accomplished by the incorporation therein of certain effective metal salts such as CuI, CuCl.sub.2, and Cu(OAc).sub.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.