Solder and soldering method for sintered metal parts
US4857695A · kind A · utility
6Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1987 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Dec 30, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3093
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided herein is a solder for sintered metal parts which is composed of Fe and/or Cr 5.about.40%, Si and/or B 1.about.5%, Cu 20.about.65%, Mn 5.about.30%, and Ni 20% and up, and optional flux 1.about.6% (by weight). The solder may lack either or both of Cu and Mn. Provided also herein is a process for soldering sintered metal parts with the solder. The solder joins parts very well with a minimum of infiltration into and corrosion to the sintered metal parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.