Apparatus for thermal treatments of thin parts such as silicon wafers
US4857704A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1998 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Dec 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0047
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for the thermal treatment of a thin part (1) includes a thermal light source including linear lamps (17) of very high unitary power such as "tungsten-halogen" lamps, and a housing (2) containing the part to be treated. The apparatus includes inside the housing (2) a chamber (4) delimited by the sidewall and the bottom (3a) of the housing as well as by a silica window, making it possible to create about the part to be treated particular conditions for thermal treatment. Within the treatment chamber there is arranged a compensation means (22a) for the thermal losses of the part to be treated. The thermal light source is configured like a light box (16a) by superimposing several modules (43) having a polygonal cross-section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.