Film forming apparatus
US4858558A · kind A · utility
21Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1988 |
| Grant date | Aug 22, 1989 |
| Priority date | — |
| Expiry date | Jan 21, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming apparatus comprises a reaction furnace having a reaction chamber therein, injection nozzles for introducing a reactive fluid, provided on the reaction furnace, a discharge nozzle for discharging a reactive fluid, provided on the reaction furnace, and a pair of susceptors located in almost vertical position in the reaction chamber and having facing sides separated by a specified distance. The susceptors include a plurality of depressions formed in the respective facing sides thereof for holding a plurality of silicon wafers. The paired susceptors are rotated in mutually opposite directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.