Process for the manufacture of printed circuits
US4859263A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1988 |
| Grant date | Aug 22, 1989 |
| Priority date | — |
| Expiry date | Mar 17, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing printed electrical circuits which comprise a substrate and copper foil applied thereto by hot embossing in a predetermined circuit pattern, said method comprising PA1 (a) providing a laminate which comprises the sequence of a printed circuit substrate, a heat activated adhesive layer, a copper foil and a carrier film which is electrically conductive, PA1 (b) passing an electrical current between two electrodes and through the carrier film wherein one electrode has sufficiently large film contact area whereby substantially no resistance heating results from the current density and the other electrode serves as an embossing tool and is of sufficiently small film contact area whereby sufficient resistance heating results from the current density to activate the adhesive layer to bond the copper foil to the substrate in the pattern of said other electrode, and PA1 (c) removing from the laminate the carrier film and such copper foil overlying areas where the adhesive was not heat activated thereby leaving a copper foil pattern bonded to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.