Embedded catalyst receptors for metallization of dielectrics
US4859571A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1986 |
| Grant date | Aug 22, 1989 |
| Priority date | — |
| Expiry date | Dec 30, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is directed to a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises PA0 a. an electrically insulative substrate bearing PA0 b. an adherent layer of crosslinked polymeric adhesive, which is insoluble in photodielectric developing solutions, having partially embedded therein finely divided particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, and PA0 c. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.