Method for manufacturing semiconductor device with leads adhered to supporting insulator sheet
US4859614A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1987 |
| Grant date | Aug 22, 1989 |
| Priority date | — |
| Expiry date | Nov 30, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1084
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising: a semiconductor chip; a package for accommodating the chip; groups of leads which are arranged around the perimeter of the package; and strip; insulators, such as plastic films, to each of which one of the groups of leads are adhered. In addition, a method for manufacturing the device, comprising the steps of: preparing a package including a semiconductor chip and having lead frames each of which is composed of leads and a supporting end portion; adhering the lead frames to an insulating sheet such as a plastic film; and clipping off the portions of the insulating sheet to which the supporting end portions are adhered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.