Wire scribed circuit boards and method of manufacture
US4859807A · kind A · utility
23Cited by
16References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1987 |
| Grant date | Aug 22, 1989 |
| Priority date | — |
| Expiry date | Oct 1, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.