Semiconductor device and process for producing the same
US4860087A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1988 |
| Grant date | Aug 22, 1989 |
| Priority date | — |
| Expiry date | Dec 13, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor device and a process for producing the same. The principal surface of a semiconductor pellet is provided with a plurality of first bonding pad electrodes arranged in a first arrangement state and a plurality of second bonding pad electrodes which are provided with substantially the same electric circuit functions as those of the corresponding first bonding pad electrodes and which are arranged in a second arrangement state that is different from the first arrangement state. By virtue of the above-described means, it is possible to connect together pad electrodes and mating external terminals of a mounting substrate in the same way regardless of whether the pellet is mounted according to the face-up or face-down method. Accordingly, it is unnecessary to prepare different kinds of pellet having individual pad arrangements which conform with respective mounting methods, and it is possible to cope with a multiplicity of different kinds of mounting method with one kind of pellet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.