Method for soldering void-free joints
US4860942A · kind A · utility
4Cited by
8References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 30, 1987 |
| Grant date | Aug 29, 1989 |
| Priority date | — |
| Expiry date | Nov 30, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for soldering without using flux and producing a void-free joint comprises the steps of melting the solder in a reducing gas atmosphere such as hydrogen, evacuating the gas to permit the solder joint to expell any trapped gas, then reintroducing the reducing gas and cooling the solder joint. The reducing gas obviates the use of flux to avoid oxidation from interfering with the wetting of the materials to be joined. The materials may be metalized prior to soldering to permit wetting of certain materials such as ceramic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.