Method of preparing silicon carbide capillaries
US4861533A · kind A · utility
16Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1987 |
| Grant date | Aug 29, 1989 |
| Priority date | — |
| Expiry date | Nov 18, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.