Co-fired metal-ceramic package
US4861646A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1987 |
| Grant date | Aug 29, 1989 |
| Priority date | — |
| Expiry date | Aug 13, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/252
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns are obtained by co-sintering a glass-ceramic composite and copper, silver, palladium, gold, based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems include composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process. The package is fabricated using a tape specifically designed for clean binder burnout in a reducing atmosphere at low temperatures and also for superior mechanical and thermal properties. Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.