Non-contact I/O signal transmission in integrated circuit packaging
US4862231A · kind A · utility
20Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 7, 1986 |
| Grant date | Aug 29, 1989 |
| Priority date | — |
| Expiry date | Feb 7, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the die to align the top of the package and the optical conduits to the die which was previously mounted in the base of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.