Semiconductor device lead frame with etched through holes
US4862246A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1988 |
| Grant date | Aug 29, 1989 |
| Priority date | — |
| Expiry date | Feb 24, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12569
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Those portions (i.e., the inner lead portions) of the leads of a semiconductor device, which are sealed by a package, are formed with a plurality of depression in at least the surfaces and backs thereof such that the depressions have a smaller diameter at their bottoms than at their surfaces. As a result, both the adhesion strength between a sealer as the package and the inner lead portions of the leads and the mechanical strength of the leads are improved even in a semiconductor device having numerous leads. Moreover, the inner lead portions can be formed in their sides with a number of notches, which can be combined with those depressions to better improve the adhesion strength between the sealant and the inner lead portions of the leads and the mechanical strength of the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.