Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
US4862322A · kind A · utility
Inventors
Key dates
| Filing date | May 2, 1988 |
| Grant date | Aug 29, 1989 |
| Priority date | — |
| Expiry date | May 2, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the active faces of each device can be electrically interconnected by placing an interconnection means between the chips to electrically interconnect input/output terminals on the active faces of the first and second device. Beam leads, each having an inner and outer lead bond site, project outwardly from between the devices where each of the inner lead bond site is solderlessly bonded between conducting patterns on each device bonded. A series of double-device structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-device structure, the inner lead bond site being solderlessly bonded between conducting patterns on each device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.