Method of treating the surface of polymers with a cuprous compound to form a copper sulfide composite structure
US4863635A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 5, 1988 |
| Grant date | Sep 5, 1989 |
| Priority date | — |
| Expiry date | May 5, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for making a conductive polymer for static charge dissipation, electromagnetic induction shielding, electroplating, or making a semiconductor comprises uniformly mixing into any number of polymer or polymer blends which are in a molten or semimolten state about 1 to about 30% by weight of sulfur to form a polymer/sulfur blend. Once the polymer/sulfur blend is solidified, by cooling, it is exposed to an aqueous cuprous ion solution whereby the cuprous ions react with the sulfur in the polymer/sulfur blend to form copper sulfide dendrites within the polymer. The aqueous cuprous ion solution may also contain elemental sulfur to aid in the formation of the copper sulfide. Additionally, the aqueous cuprous ion solution may also contain an effective amount of dilute hydrochloric acid or dilute ammonium hydroxide to aid in the facilitation of complexation. The conductive polymers of the present invention have a resistivity of less than about 10,000 ohms/sq. and preferably less than about 400 ohms/sq.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.