Method and apparatus for subdividing into pieces a ceramic plate
US4865241A · kind A · utility
9Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 7, 1984 |
| Grant date | Sep 12, 1989 |
| Priority date | — |
| Expiry date | Dec 7, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/329
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention provides a method and apparatus for breaking ceramic substrates which are used in the manufacture of hybrid electronic circuits. The substrate to be divided is subjected to a predetermined rigid deformation by means of two rigid dies having a circular cross-section with radii which differ. The centers of curvature of the circular cross-sections coincide when the dies are in their final position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.