Patent · US Expired

Direct mold clamping apparatus with ejector

US4865536A · kind A · utility

14Cited by
1References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 17, 1988
Grant dateSep 12, 1989
Priority date
Expiry dateJun 17, 2008

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C45/66
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

There is provided a direct mold clamping apparatus with an ejector, which is capable of uniformly applying a mold clamping force to a movable platen and is simple in construction and compact in size. A hollow cylindrical push member (12) and a movable platen (3) are coupled to each other through a single junction plane, in the form of an annular ring. A driving force transmitted through the push member is applied uniformly to the movable platen. The ejector (1) of the mold clamping apparatus (2) is provided with a ball nut (7) disposed in a hollow portion of the push member. A ball screw (6), which mates with the nut, is coaxial with a ball screw (8) for mold clamping, and has a front end fixed to an ejector pin (4) and the rear end portion removably fitted in a hole (8a) in a front end portion of the mold clamping ball screw. Thus, the axial length of the mold clamping apparatus is reduced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.