Copper-free gold alloy composition
US4865809A · kind A · utility
2Cited by
2References
8Claims
0Family size
Inventor
Key dates
| Filing date | Sep 30, 1988 |
| Grant date | Sep 12, 1989 |
| Priority date | — |
| Expiry date | Sep 30, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C30/00
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A gold colored, tarnish and corrosion resistant copper free allow is disclosed usable for jewelry, dental purposes and the like. The alloy consists essentially of 8 to 20 percent Gold, 22 to 26 percent Indium, 22 to 28 percent Palladium, and the balance is essentially Silver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.