Electroless deposition employing laser-patterned masking layer
US4865873A · kind A · utility
90Cited by
7References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 1987 |
| Grant date | Sep 12, 1989 |
| Priority date | — |
| Expiry date | Dec 7, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/165
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.