Metallic bond for mounting of optical fibers to integrated optical chips
US4867524A · kind A · utility
28Cited by
6References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1988 |
| Grant date | Sep 19, 1989 |
| Priority date | — |
| Expiry date | Sep 8, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4225
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for pigtailing an optical fiber to a lithium niobate integrated optical device (I/O chip) is shown and described wherein the bonding between the I/O chip and the optical fiber is a metallic bond. The lithium niobate may be attached to a metallic substrate which is welded to a metallic fiber optic carrier which is in turn welded to a metallized optical fiber. The fiber optic carrier may also be made of non-metallic materials which are given a metallic coating prior to attachment to the I/O chip by means of a metallic bond such as welding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.