Method and apparatus for forming a thick film integrated circuit
US4868007A · kind A · utility
13Cited by
5References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 20, 1988 |
| Grant date | Sep 19, 1989 |
| Priority date | — |
| Expiry date | Sep 20, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for forming thick-film integrated circuits provides a secondary up-down mover which prevents a nozzle from being damaged. A spring is applied to the secondary mover as a shock-absorber acting when the nozzle descends to a substrate. A restrictor is provided which restricts the action of the secondary up-down mover by solenoid action, such that the nozzle is accurately ascended from the substrate by a predetermined dimension with the secondary up-down mover in the restricted condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.