Printed wiring board
US4868047A · kind A · utility
5Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1988 |
| Grant date | Sep 19, 1989 |
| Priority date | — |
| Expiry date | Feb 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An injection molding resin-type printed wiring board having an electric circuit pattern layer formed integrally on the surface thereof and having reduced warpage. In the printed circuit board, the injection molding resin includes a thermoplastic resin composition essentially comprising polyethylene terephthalate and containing a flaky inorganic reinforcing material. The inorganic reinforcing material comprises single-substance fine mica flakes or a mixture of fine mica flakes and short glass fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.