Thermally stable dual metal coated laminate products made from textured polyimide film
US4868071A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1988 |
| Grant date | Sep 19, 1989 |
| Priority date | — |
| Expiry date | Feb 16, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.