Method of and apparatus for mounting chips
US4868979A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1989 |
| Grant date | Sep 26, 1989 |
| Priority date | — |
| Expiry date | Jan 6, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of mounting chips on a circuit board having a plurality of divided regions provided thereon comprising the steps of: forcibly delivering chips housed bulky in a housing container composed of a plurality of containers by delivering means to housing recesses provided on a template in positions corresponding to positions where the chips are mounted on the circuit board; moving a chip transfer means over the circuit board, the transferring means provided for transferring the chips housed in the housing recesses to the circuit board while the chips are held in same positions as they are delivered by the guide means; loading the circuit board on a base; and shifting the circuit board successively along multiple divided regions provided on the circuit board to the position of the housing recesses by means of a chip shifting means so that the chips can be mounted on the multiple divided regions. The apparatus for carrying out the method is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.