Process for placing single or multiple patterned layers of conductive material on a substrate
US4869767A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1987 |
| Grant date | Sep 26, 1989 |
| Priority date | — |
| Expiry date | Jun 2, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/108
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention consists of an improved method for placing single or multiple patterned layers of conductive material on a substrate. The method provided includes the step of placing or depositing a thin patterned layer of electrically conductive material on a substrate. The procedures used to deposit this layer include mechanically adhering the layer to the substrate then removing portions of it to form a pattern. They also include printing adhesive on the substrate and using it to peel a conductive pattern off of the surface of a transfer agent. After depositing the first conductive pattern, the process prints an insulating layer on top of it. The insulating layer has openings through which the next conductive pattern makes electrical contact with the first. Similarly, the process places other conductive layers and prints other insulating layers between them to produce multiple layers of conductive patterns. The multilayer circuit board provided includes a substrate. It also includes conductive layers separated by insulating layers and electrically interconnected through openings in those insulating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.